Lam Research Corporation (LRCX) Covered Calls

Lam Research Corporation covered calls Lam Research Corporation is a global leader in the design and manufacture of semiconductor processing equipment used in the fabrication of integrated circuits. The company specializes in deposition and etch technologies, which allow chipmakers to create the intricate, microscopic structures required for advanced logic and memory chips. Lam’s systems are essential for producing virtually every advanced semiconductor in the world, supporting the transition to 3D architectures and AI-driven devices

You can sell covered calls on Lam Research Corporation to lower risk and earn monthly income. Born To Sell's covered call screener gives you customized search capabilities across all possible covered calls but here are a couple of examples for LRCX (prices last updated Tue 4:16 PM ET):

Lam Research Corporation (LRCX) Stock Quote
Last Change Bid Ask Volume P/E Market Cap
226.61 -2.67 226.44 227.25 7.5M 47 286
Covered Calls For Lam Research Corporation (LRCX)
Expiration Strike Call Bid Net Debit Return
If Flat		 Annualized
Return If Flat
Feb 20 227.5 8.25 219.00 3.8% 126%
Mar 20 230 16.40 210.85 7.9% 73.9%
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Extended Business Description

Core Business and Products

Lam Research Corporation (LRCX) is a fundamental architect of the semiconductor industry, providing the critical wafer fabrication equipment (WFE) used to build the world’s most advanced chips. As of early 2026, Lam has solidified its position as a key enabler of the "AI architectural revolution," specifically focusing on the transition to three-dimensional chip structures and advanced packaging. The company’s business is driven by a massive installed base of over 100,000 chambers, providing a steady stream of recurring service and spare parts revenue.

  1. Etch and Deposition: Lam is the global leader in plasma etch and a primary player in thin-film deposition. In 2026, its "Akara" conductor etch system has become the industry standard for high-aspect-ratio etching in advanced DRAM and foundry-logic nodes. These tools are vital for creating the "Gate-All-Around" (GAA) transistors and backside power distribution networks that define the next generation of 2nm and 1.4nm chips.
  2. Advanced Packaging and HBM: With the rise of High-Bandwidth Memory (HBM4 and HBM4E), advanced packaging has become a central growth pillar. Lam’s electroplating and Through-Silicon Via (TSV) etch technologies are essential for stacking up to 16 layers of memory. The company expects its advanced packaging segment to grow by over 40% in 2026, significantly outperforming general market growth.
  3. NAND and DRAM Solutions: Lam has the industry's largest installed base for NAND flash production. In 2026, the company is benefiting from a recovery in the NAND market, driven by the demand for high-capacity SSDs in AI data centers. Its tools facilitate the move toward 300-plus layer NAND structures.
  4. Customer Support Business Group (CSBG): This segment provides services, spares, and "Reliant" refurbished equipment. By 2026, Lam has integrated "Dextro" cobots and digital twin simulations to automate fab maintenance, significantly increasing productivity for its customers.

Competitive Landscape

The semiconductor equipment market is highly concentrated, with a few players controlling specialized niches of the fabrication process:

  1. Broad-Based Rivals: Lam’s primary competitor is Applied Materials, which competes directly in the etch and deposition categories. While Applied Materials has a broader portfolio, Lam often maintains a technical edge in specific high-aspect-ratio etch applications.
  2. Process Control and Lithography: The company works alongside ASML (lithography) and KLA Corporation (inspection), whose tools are complementary to Lam’s process steps. However, these firms compete for the same capital expenditure budgets from chipmakers like TSMC and Intel.
  3. Regional Competitors: In the Asian markets, Lam competes with Tokyo Electron and specialized firms like ASM International, particularly in atomic layer deposition (ALD) and coater/developer technologies.

Strategic Outlook and Innovation

As of February 2026, Lam Research is projecting a robust second half of the year as global cleanroom capacity expands to meet pent-up AI demand. The company is forecasting a total addressable wafer fab equipment market of $135 billion for 2026. A key strategic priority is "Autonomous Fabrication," where Lam is using AI-driven fleet matching to ensure its tools perform identically across different global sites. Innovation is further highlighted by a multi-year partnership with CEA-Leti to develop "Specialty Technology" for quantum optics and energy-efficient compound semiconductors. With an operating margin consistently exceeding 34% and a focused strategy on the most complex 3D scaling challenges, Lam Research remains an indispensable partner for the world’s leading chipmakers in the AI era.